GlobalFoundries and Qualinx Demonstrate First European Sovereign Manufacturing Flow for Security‑Critical Semiconductors
GlobalFoundries (GF) and Qualinx today announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology. The milestone demonstrates that security-critical chips for aerospace, defense and critical infrastructure can be designed, manufactured and delivered entirely within Europe.
Qualinx to Showcase World’s Most Power-Efficient and Only Reconfigurable GNSS Chip and Developer Evaluation Kit at Embedded World 2026
Qualinx, the European semiconductor company redefining ultra-low-power connectivity, today announced plans to showcase its market-ready 1 mW QLX3Gx Series GNSS chip with its dynamic reconfigurable architecture, along with a Developer Evaluation Kit (EVK), at Embedded World 2026 from 10-12 March in Nuremberg. The QLX3Gx EVK enables OEMs to directly validate Qualinx’s power-to-performance leadership and integration readiness in real-world device environments across IoT, UAVs, wearables, asset tracking, mobility and infrastructure applications. Additional demos include ultra-low-power GNSS powered by Dragonfly Digital RF, on-chip Galileo authentication with EUSPA’s OSNMA, QLX3AX AFE flexibility, beacon-to-beacon communication and sustainable smartwatch integration.
Qualinx Raises €20M to Scale Market-Ready, Ultra-Low-Power GNSS Chip that Redefines the Connected Edge
Qualinx, the European semiconductor company redefining ultra-low-power connectivity at the connected edge, today announced a €20 million investment led by Invest‑NL, with additional participation from existing investors FORWARD.one, InnovationQuarter Capital and Waterman Ventures, and brings Qualinx’s total funding to date to €40 million. The funding supports and accelerates Qualinx’s growth to scale mass production of its market-ready QLX3Gx Series GNSS chip and fulfill demand from global OEMs across consumer electronics, including wearables, pet trackers, IoT, drones and UAVs, vehicle and asset tracking, telecommunications, satellites and more. A series B round is planned in H2 2026.
